A Comprehensive Introduction to NVMe Solid State Drive Form Factors
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Introduced 10 years ago, the NVMe specifications took NAND flash storage to unprecedented levels of speed and performance, with 6X the throughput and 7X lower latency than Serial ATA 6 Gbps (also commonly known as SATA III). Storage devices supporting the NVMe protocol connect to the host system using the PCI Express (PCIe) bus, leveraging its excellent features for scalability, low latency and fast performance.
NAND flash storage supporting the NVMe protocol comes in several form factors using different interfaces, which we will discuss in this article.
M.2 Cards/Modules
M.2 (pronounced M-dot-two) is a specification for internal expansion cards. It was formerly known as the Next Generation Form Factor (NGFF) and was created as a successor of the mSATA standard.
This specification allows flexible physical forms. Modules can come in different widths and lengths, with connectors supporting both legacy SATA interface (via AHCI) and PCIe interface (via NVMe). To ensure compatibility with the host system, M.2 card connectors are uniquely keyed depending on the card’s purposes or capabilities.
ATP's NVMe-based M.2 solid state drives come in three forms:
· M.2 2280. Each module measures 22 mm wide and 80 mm long, and comes in double-sided configuration, which means that components are installed on both top and bottom sides of the module.
The following table compares the physical appearance and key specifications of ATP’s NVMe-based M.2 2280 SSDs.
Table 1. ATP M.2 2280 NVMe SSD Specifications
· M.2 Type 1620 HSBGA. Heatsink ball grid array (HSBGA) SSDs are ATP’s tiniest flash storage solutions supporting the NVMe protocol. As soldered-down solutions, they are secure in place even during constant vibrations and rigorous operations. The HSBGA measures 16 (L) x 20 (W) x 1.6 (H) mm) and use high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane.
Table 2. ATP NVMe M.2 HSBGA SSD Specifications
· 2.5” U.2
SSDs with the U.2 (pronounced U-dot-two) connector support the PCIe interface via the NVMe protocol. Formerly known as SFF-8639, U.2 uses a total of four PCIe lanes for a maximum theoretical bandwidth of up to 32 Gbps. ATP’s NVMe U.2 SSDs are similarly sized as 2.5” SATA SSDs. They are designed with aluminum housing for better heat dissipation.
The following figure compares the physical appearance of the 2.5” with U.2 SSDs and shows the U.2 connector.
Figure 1. From left: 2.5” SATA SSD, U.2 SSD and U.2 connector
EDSFF
The Enterprise and Datacenter SSD Form Factor (EDSFF) family of specifications was developed by a group of 15 companies to meet the increasing data generation and consumption requirements of data center storage. EDSFF SSDs come in different form factors but share the same NVMe protocol, PCIe interface, edge connector, and pinout and functions.
EDSFF form factors are listed below. Each form factor has different variants.
· E1.L (EDSFF 1U Long). It was inspired by Intel's "ruler" form factor, which offered capacities that were unavailable from other SSD configurations. It is designed for high-capacity and dense storage use cases. As its name implies, E.1L was “developed to maximize capacity per drive and per rack unit in a 1U server or storage array.”
· E1.S (EDSFF 1U Short). The E1.2 is more like the M.2 and U.2 – small and compact, just a bit longer to accommodate more flash memory. It is also hot-pluggable, unlike the M.2.
· EDSFF E3.L and E.3S. These form factors are optimized for 2U servers and are similar to 2.5” SSDs. The E3 connector can support up to x16 PCIe lanes, while most SSDs today support up to x4 lanes.
Conclusion
The NVMe protocol has enabled NAND flash storage devices to break the barriers of SATA. As the world continues to generate more data, ATP takes advantage of technological advances to make sure that your data is stored safely, accessed speedily, and transformed into actionable insight when needed.
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ATP DRAM-Less Value系列固态硬盘提供I-TEMP/C-TEMP可操作型号产品系列活页
ATP推出ATP DRAM-less Value Line SSDs,包括N600Vi/Vc系列和A600Vi/Vc系列。N600Vi/Vc系列采用PCIe Gen3 x4、NVMe 1.3接口,A600Vi/Vc系列采用SATA III 6 Gb/s接口。两款系列均提供多种容量选项,支持I-Temp/C-Temp工作温度,具备基于固件的电源故障保护功能。这些SSDs适用于工业/嵌入式应用,具有高性价比、可靠性和长期供应承诺。
ATP - MSATA VALUE LINE SOLID STATE DRIVES,固态硬盘,VALUE LINE SSDS,价值线固态硬盘,SSDS,MSATA超值系列固态硬盘,无DRAM超值系列固态硬盘,DRAM-LESS VALUE LINE SSDS,FT1T00MSAAN2BFC,FT120GP38APDBFI,FT256GM24AN2BFC,FT256GM28AN2BFI,FT256GM24AN2BFI,FT1T00MSAAN2BFI,FT512G25SAN2BFI,FT480GP38APDBFI,FT256GM28AN2BFC,A600VI,FT512G25SAN2BFC,FT128GMSAAN2BFI,A600VC,FT240GP34ANDBFC,FT1T00M28AN2BFC,FT120GP34APDBFI,FT128GMSAAN2BFC,FT240GP38APDBFI,FT1T00M28AN2BFI,FT512GMSAAN2BFI,FT240GP38ANDBFC,FT240GP34APDBFI,FT512GMSAAN2BFC,FT960GP34APDBFI,FT1T0025SAN2BFC,FT128GM24AN2BFI,FT512GM28AN2BFC,FT1T0025SAN2BFI,FT480GP34ANDBFC,FT960GP38ANDBFC,FT128G25SAN2BFC,N600VI SERIES,N600VI,FT128G25SAN2BFI,FT960GP34ANDBFC,FT128GM24AN2BFC,FT960GP38APDBFI,N600VC,FT512GM28AN2BFI,FT256G25SAN2BFI,FT256GMSAAN2BFI,FT512GM24AN2BFI,FT128GM28AN2BFC,FT480GP38ANDBFC,FT256G25SAN2BFC,N600VC SERIES,FT120GP38ANDBFC,FT256GMSAAN2BFC,FT480GP34APDBFI,FT1T00M24AN2BFI,FT1T00M24AN2BFC,FT120GP34ANDBFC,FT128GM28AN2BFI,FT512GM24AN2BFC,WEB SERVERS,INDUSTRIAL/EMBEDDED BOOT DRIVES,信息亭,POINT-OF-SALE SYSTEMS,销售点系统,POS,工业/嵌入式应用,工业/嵌入式引导驱动器,INDUSTRIAL/EMBEDDED APPLICATIONS,BOX PCS,KIOSK,盒装PCS,网络服务器
M.2 2280 PSLC NVMe SSDs Break 3D TLC Limits wth 2000 MB/s Sustained Sequential Write Performance
ATP ELECTRONICS introduces its latest line of M.2 2280 NVMe solid state drives (SSDs) built on 3D triple level cell (TLC) NAND flash.
What is NVMe SSD and What are the Benefits?
ATP M.2 2280 NVMe SSDs are designed for a PCIe 3.0 x4 interface and comply with NVMe 1.2 specifications. Along with up to 1 TB memory capacity, sequential read speed of up to 2,540 MB/s, and sequential write speeds up to 1,100 MB/s, ATP M.2 NVMe SSDs exceed the SATA interface bandwidth 2x-3x, eliminate bottlenecks, and deliver a dramatic performance boost over AHCI standards. ATP M.2 2280 NVMe SSDs integrate 3D NAND MLC technology, enabling higher memory capacity, lower cost per bit, and increased longevity.
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可定制ATP TE Cooler的冷却功率:40~200W;运行电压:12/24/48V(DC);控温精度:≤±0.1℃; 尺寸:冷面:20*20~500*300;热面:60*60~540*400 (长*宽;单位mm)。
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