【选型】EPSON温度补偿晶体振荡器助力Sub-1G无线通信模块小型化设计，初始精度1.5PPM

时间： 2022-09-03 来源：世强

技术问答

随着物联网通信芯片与模块的发展，万物互联的理念慢慢照进了现实，为了实现无线通信模块收发灵敏度的提升，提高无线通信的信号传输距离与通信可靠性，一颗高稳定性、高精度的参考时钟芯片是不可或缺的。本文推荐一颗时钟芯片龙头EPSON的温度补偿晶体振荡器(TCXO) X1G005441011611，助力Sub-1G无线通信模块小型化设计和通信质量的提升。

以下为其在Sub-1G无线通信模块的设计框图

X1G005441011611拥有如下优势：

1、小封装。系列拥有2520、2016两种小封装，助力无线模块的小型化。

2、高初始精度。拥有1.5PPM的初始精度，相较于SPXO大大提升了时钟信号的稳定性。

3、低温漂，高温度稳定性。支持最低0.5PPM的频偏，在高温环境仍然提供高精度的时钟信号。

4、低功耗。1.5-2.1mA的最大功耗，助力无线模块低功耗的需求。

5、1.8V、2.8V、3.3V宽范围供电电压，宽泛的供电电压设计。

综上所述，为了Sub-1G模块的小型化、低功耗和高通信质量的需求，X1G005441011611是无线模块中晶振芯片的理想之选。

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X1G0060010093xx TG-5510CA-93N 40.000000 MHz Temperature Compensated Crystal Oscillator (TCXO)

型号- TG5510CA-80N,TG5510CA-92N,TG5510CA-90N,X1G0060010093XX,TG5510CA-78N,TG5510CA-98N,TG5510CA-76N,TG5510CA-96N,X1G006001008214,TG5510CA-82N,X1G006001008114,TG5510CA-94N,TG7050CMN,TG7050CKN,TG-5510CA-93N 40.000000 MHZ,TG5510CA-91N,TG5510CA-81N,X1G006001009614,X1G006001009514,TG-5510CA,TG7050SMN,X1G006001007714,TG7050SKN,X1G006001007814,TG5510CA-77N,TG5510CA-97N,TG-5511CA,TG5510CA-95N,X1G006001009414,TG5510CA-85N,X1G006001009314,TG5510CA-93N,X1G006001009114,X1G006001XXXX14,TG5510CA-79N,X1G006011XXXX14,X1G005691XXXX,X1G005661XXXX14,X1G005671XXXX14,X1G005681XXXX14,TG-5510CA30.720000MHZ****

数据手册 - EPSON - rev: 1.0 - 2021/6/8 PDF 英文下载

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数据手册 - EPSON - ver1.07 - 2021/6/11 PDF 英文下载

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数据手册 - EPSON - ver.1.3 - 2020/11/16 PDF 英文下载