【选型】EPSON温度补偿晶体振荡器助力Sub-1G无线通信模块小型化设计,初始精度1.5PPM

2022-09-03 世强
温度补偿晶体振荡器,TCXO,X1G005441011611,EPSON 温度补偿晶体振荡器,TCXO,X1G005441011611,EPSON 温度补偿晶体振荡器,TCXO,X1G005441011611,EPSON 温度补偿晶体振荡器,TCXO,X1G005441011611,EPSON

随着物联网通信芯片与模块的发展,万物互联的理念慢慢照进了现实,为了实现无线通信模块收发灵敏度的提升,提高无线通信的信号传输距离与通信可靠性,一颗高稳定性、高精度的参考时钟芯片是不可或缺的。本文推荐一颗时钟芯片龙头EPSON温度补偿晶体振荡器(TCXOX1G005441011611,助力Sub-1G无线通信模块小型化设计和通信质量的提升。


以下为其在Sub-1G无线通信模块的设计框图

X1G005441011611拥有如下优势:

1、  小封装。系列拥有2520、2016两种小封装,助力无线模块的小型化。

2、  高初始精度。拥有1.5PPM的初始精度,相较于SPXO大大提升了时钟信号的稳定性。

3、  低温漂,高温度稳定性。支持最低0.5PPM的频偏,在高温环境仍然提供高精度的时钟信号。

4、  低功耗。1.5-2.1mA的最大功耗,助力无线模块低功耗的需求。

5、1.8V、2.8V、3.3V宽范围供电电压,宽泛的供电电压设计。

 

综上所述,为了Sub-1G模块的小型化、低功耗和高通信质量的需求,X1G005441011611是无线模块中晶振芯片的理想之选。


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