Ventec Builds Global Inventory of High-Speed/Low-Loss Materials to Deal with Laminate Material Supply Issues
In response to high demand and laminate material supply issues affecting some producers of low transmission loss and high-frequency laminates and prepregs, Ventec International Group Co., Ltd. (6672 TT) has implemented material inventory & supply chain measures with favorable order requirements. In doing so, Ventec ensures that customers can continue to rely on uninterrupted material delivery through the company’s fully controlled and managed global supply chain.
Many PCB manufacturers around the world are currently experiencing supply issues and long lead-times for high-speed low loss & high-frequency materials due to a combination of supply chain disruption and increased demand from 5G applications. In response to the resulting increased demand for Ventec’s tec-speed solutions, the company has made key strategic supply chain adjustments for fast manufacturing cycle times with expedited and flexible freight logistics to ensure customers can continue to rely on Ventec’s fully managed and controlled supply chain for uninterrupted material delivery around the globe.
At its manufacturing plants in China and Taiwan, production capability and capacity for critical materials have been increased to allow for current and anticipated greater demand as 5G applications grow. At the same time, inventory of Ventec’s tec-speed 6.0, 7.0, 7.1 & 20.0 high-speed low loss & high-frequency materials is being built in all overseas warehouse facilities (UK, Germany, USA) for quick turn-around deliveries. Reduced minimum order quantity requirements are being offered to help new customers fulfill their manufacturing obligations.
"Since the supply of high-speed, low transmission loss materials has tightened, PCB manufacturers and OEMs are being forced to manage risks such as long lead times and supply disruptions," explains Mark Goodwin, COO Europe & Americas. "Ventec offers a range of products that remain unaffected by capacity constraints. Our customers are thus benefiting from uninterrupted access to high-quality material solutions with normal lead times. Given the circumstances, we've also relaxed some of our standard order requirements for those materials to help customers manage their needs."
- |
- +1 赞 0
- 收藏
- 评论 0
本文由三年不鸣转载自Ventec,原文标题为:Ventec Builds Global Inventory of High-Speed/Low-Loss Materials,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
Ventec to Showcase New Range of High-performance PCB laminates and Prepregs at IPC APEX Expo 2023
Ventec will be launching a range of new PCB laminate and prepregs at the IPC APEX Expo in San Diego, CA. New additions to the tec-speed and tec-thermal ranges offer excellent performance in demanding conditions and harsh environmental applications. Ventec will be also showcasing autolam solution developed for the automotive industry and aerolam working for aviation, aerospace, and defense applications.
原厂动态 发布时间 : 2023-01-19
Ventec新系列PCB层压板将首次亮相2023年美国IPC APEX博览会,可提供优异导热性能
Ventec不断扩大PCB材料范围,旨在满足PCB制造行业的技术需求,将在圣地亚哥举办的2023 IPC APEX博览会上推出一系列新的PCB层压板和预浸料,提供优异导热性能。
原厂动态 发布时间 : 2023-01-17
专业5G光通讯胶黏剂应用方案提供商汉司积极探索5G时代,黏接智慧未来
5G对5G时代超大带宽、高精密光器件对胶黏剂的可靠性、品质提出了更高的要求。汉司亮相CIOE中国国际光电博览会,作为专业5G光通讯胶黏剂应用方案提供商,汉司立足于5G市场大众客户群体,对于5G时代胶黏剂的辅助应用提供更全方位的解决方案。
原厂动态 发布时间 : 2023-04-27
【产品】腾辉电子推出半固化片tec-speed 6.0 H-PK-VT-770/VT-770(LK),高模量且高Tg
腾辉电子推出半固化片型号tec-speed 6.0 H-PK-VT-770/VT-770(LK),无卤素&高Tg(260℃ DMA),具有优异的热可靠性,低Dk,极低Df,高模量,低CTE,适用于CSP、倒装芯片封装、SiP、AiP、BGA&PGA等。
产品 发布时间 : 2023-07-01
Ventec Launches tec-speed 20.0 VTM1000i Hydrocarbon Laminate, with High Dk of 9.8 and Low Df of 0.0023
Ventec has launched the new tec-speed 20.0 VTM1000i hydrocarbon laminate that offers impressive thermal reliability and exceptionally high Dk (9.8) and lows Df (0.0023) typically seen only in PTFE materials.
新产品 发布时间 : 2022-12-16
【产品】腾辉电子推出不流动和低流动度半固化片VT-462SH,无铅兼容且环保,用于散热器粘结和软硬结合板
腾辉推出极低损耗,不流动和低流动度半固化片型号tec-speed 6.0 H-LF - VT-462SH NF/LF,无卤素和无铅兼容,优化的流量范围,环保,可应用于散热器粘结和软硬结合板。
产品 发布时间 : 2023-06-02
【产品】5G时代的高频板材初探——罗杰斯PCB板
随着电子技术的越来越发达。电子产品的生产对材料的要求也越来越多。5G时代必须利用高频频段,导致其必须有匹配的硬件材料,比如高频材料。以罗杰斯为例。罗杰斯PCB板材料是Rogers公司生产的一种高频板材型号,不同于常规的PCB用板材环氧树脂,它中间没有玻纤是以陶瓷基高频材料。
新产品 发布时间 : 2019-12-10
登录 | 立即注册
提交评论