【产品】镀镍石墨填充的单组分导电硅胶密封剂CHO-BOND®1016,对铝基板有良好的耐电镀腐蚀性
PARKER CHOMERICS是财富250强——运动和控制技术全球领导者Parker Hannifin的子品牌,也是导电和热界面材料开发和应用的全球领导者。旗下主要产品导热材料及EMI屏蔽材料,具有性价比高、屏蔽性好、耐腐蚀性强等特点,可广泛应用于高铁、通信、基站、手机、航天、汽车、消费、工业、医疗、人机界面、高可靠性应用等领域。
Parker Chomerics推出的CHO-BOND®1016是一种镀镍石墨填充的单组分导电硅胶密封剂,专门设计用作电气外壳上的填角,间隙填料和接缝密封剂,用于EMI屏蔽或电气接地。
CHO-BOND®1016最小推荐粘合覆盖厚度为0.010英寸(0.25毫米),最大推荐粘合覆盖厚度为0.040英寸(1.02毫米),最小剥离强度为8.0 lb./inch(1401 N / m),适用于中等搭接剪切强度(150 psi(1034 kPa))的应用中,如EMI垫片修复、粘接和连接;采用镀镍石墨填料,对铝基板具有良好的耐电镀腐蚀性,在需要射频场屏蔽和减少内部辐射发射的壳体应用中具有良好的EMI屏蔽效能。
CHO-BOND®1016是中等粘贴黏度的湿气固化硅胶,不含挥发性有机物(VOC),固化过程成中不会产生损坏基材的腐蚀性副产物,固化时收缩非常小,并在各种应用温度下提供灵活、有弹性的导电和环境密封性能,工作时间30分钟,可快速形成表皮结壳,能够在24小时内固化(室温完全固化则需要1周时间); 为获得最佳的粘合效果,通常将CHO-BOND®1016与CHO-SHIELD® 1086底漆配合使用。
图1 CHO-BOND®1016单组分导电硅胶密封剂
CHO-BOND®1016是一种深灰色的干介质有机硅胶,比重为2.4,硬度为80 Shore A,单组分特性使得在使用的时候无需进行混合或称重等操作,更加易于处理和使用,可以在-55°C至125°C的宽温度范围内使用,在覆盖厚度为0.010“时,每磅(454克)可以覆盖达1250平方英寸(8065平方厘米)的面积,覆盖直径为1/8 “时,每磅(454克)可以覆盖距离长达80英尺(24.4米),常温下保质期为6个月(未开封,25°C)。
图2 CHO-BOND®1016应用示例
CHO-BOND®1016的特性和优点:
•单组分;
•镀镍石墨填料;
•易于使用,无需称重或混合;
•中等导电率0.500 ohm-cm;
•湿气固化硅胶,收缩率最小;
•无挥发性有机物(VOC);
•低成本,对铝基板具有良好的耐电镀腐蚀性;
•无腐蚀性固化机制,固化过程中不会产生腐蚀性副产物,损坏基材;
•30分钟的工作寿命,快速形成表皮结壳,固化时间24小时,固化过程中无需压力,完全固化时间为一周;
•应用温度范围广:-55°C至125°;
•重量轻,每克材料的覆盖范围更大,可使得部件或车辆的重量最小;
•中等黏糊状物质;
•易于分配、使用和涂抹,可用于架空或垂直表面;
CHO-BOND®1016典型用途:
•便携式电子设备;
•雷达和通信系统;
•EMI通风口;
•军用地面车辆和遮蔽物;
•EMI垫片修复、粘接和连接;
•电气外壳上的填角、间隙填料和接缝密封剂;
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本文由sdlibin007翻译自Parker Chomerics,版权归世强硬创平台所有,非经授权,任何媒体、网站或个人不得转载,授权转载时须注明“来源:世强硬创平台”。
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Electrically Conductive Silicone Adhesive and Sealant Application Procedure
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