【产品】使用陶瓷填充的无卤素导热间隙填料OP-8300 Spec 06,导热率1.5W/m-K
仕来高推出的OP-8300 Spec 06导热间隙填料是一种使用陶瓷填充的硅胶弹性体,非常柔软,适用于要求中等热性能的应用。OP-8300 Spec 06配方符合ROHS和无卤素标准,为禁用有害物质的应用提供了额外保障。
OP-8300 Spec 06为不导电材料,且具有天然粘性,通常不需要额外的粘合剂。
产品特性
导热率1.5W/m-K
超强可压缩性
性价比高
天然粘性
电气隔离
符合RoHS标准
无卤素
典型应用
笔记本电脑和台式电脑
内存模块
热管组件
硬盘和DVD
平板显示器
电信硬件
可选配置
可模切成特定尺寸
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本文由Yana翻译自仕来高,版权归世强硬创平台所有,非经授权,任何媒体、网站或个人不得转载,授权转载时须注明“来源:世强硬创平台”。
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使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
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可定制均温板VC最薄0.4mm,有效导热系数超5,000 W / m·K(纯铜(401 W/m·K ,石墨烯1,200 W/m·K)。工作温度范围同时满足低于-250℃和高于2000℃的应用,定制最低要求,项目年采购额大于10万人民币,或采购台套数大于2000套。
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