【材料】 鸿富诚SMT导电泡棉系列，低压缩率（10%-20%）下导电性能良好，满足高密度PCB上小面积接地屏蔽

鸿富诚（HFC）热界面材料/屏蔽材料/吸波材料选型指南

公司介绍 Company Profile    热界面材料介绍 Thermal Interface Material Introduction    导热硅胶垫片 Thermal Pad    各向异性导热垫片 Anisotropic Thermal Pad    导热凝胶 Thermal Gel    导电泡棉 FOF Gasket    石墨泡棉 Graphite Foam    半包型导电泡棉 Half-wrapped Gasket    SMT导电泡棉 SMT Gasket    全方位导电泡棉 XYZ Conductive Foam    导电PE Conductive PE    导电毛丝 Conductive FOA    导电布胶带 Conductive Fabric Tape    铜/铝箔胶带 Copper/Atuminum Foil Tape    吸波材料 Wave-absorbing Material    导热吸波材料 Thermal Conductive Absorbing Material   

鸿富诚  -  SINGLE-COMPONENT THERMAL GEL,SMT导电泡棉,WAVE-ABSORBING MATERIAL,导热硅胶,THERMAL INTERFACE MATERIAL,导热硅胶垫片,铝箔胶带,导电布,导电毛丝,FOF垫圈,SHIELDING MATERIAL,ANISOTROPIC THERMAL PAD,导热吸收材料,导电泡棉,吸波材料,铜/铝箔胶带,全方位导电泡棉,WAVE ABSORBING MATERIAL,铜箔胶带,各向异性热垫,FOF GASKET,导电织物胶带,热界面材料,导电布胶带,半包垫片,COPPER FOIL TAPE,导热吸波材料,导热垫片,CONDUCTIVE PE,COPPER/ALUMINUM FOIL TAPE,THERMAL GEL,半包型导电泡棉,单组分热凝胶,双组份导热凝胶,XYZ CONDUCTIVE FOAM,双组分热凝胶,石墨泡棉,GRAPHITE FOAM,导热垫,导电FOA,TWO-COMPONENT THERMAL GEL,THERMAL CONDUCTIVE ABSORBING MATERIAL,网通应用高导热材料,CONDUCTIVE FABRIC TAPE,XYZ导电泡沫,CONDUCTIVE FOA,热凝胶,HALF-WRAPPED GASKET,导电聚乙烯,各向导性导热垫片,ALUMINUM FOIL TAPE,石墨泡沫,各向异性导热垫片,屏蔽材料,SMT GASKET,导电PE,COPPER/ATUMINUM FOIL TAPE,导热凝胶,单组份导热凝胶,SMT垫片,THERMAL PAD,H800-LY,HFS-15,HFS-18,H100,HFC-MC,H300,HFC-SMT,H500,H700,H350-SOFT,H100RS,H300-RB,HTG-150DK,HFC-MC系列,HTG-150D,HFC-GB系列,SMFB系列,H200RS,HFC-MFZ系列,HFC-AM,H1200,H250,HFC-GR系列,HTG-1000,HTG-100DK,H1000,HFS-20,H1000-SOFT,H150RS,HFC-A18000,SMFB,H250RS,HTG-600,HTG-500SF,HTG-800,SMFA,HTG-200,HFC-AM系列,HFC-MF,H300MAS,HFC-MT,SMT,H500-RB,HTG-200D,HFC-A系列,HFC-A25000,H150A15,H500-LY,HTG-800D,H100A15,HFS-30,HFC-AM5000,H200,H400,H600,H200-SOFT,H800,H300-SOFT,H100-SOFT,HFC-MF系列,HFC-AM1000,H200MAS,HFC-A5000,SMFA系列,H300-HC,HTG-300SF,HFC-MFZ,H150,HFC-GR,HTDG-250,H150-LY,H700-SOFT,H600-LY,H300-LY,HFC-A,H300-HR,H300-DR,SMT系列,HTG-300,HFC-GB,H200-LD,HTG-500,H150-LD,COMMUNICATION EQUIPMENT,通讯设备,直流接地,MOBILE PHONES,射频,HEAT SINK,5G MOBILE PHONE,摄像头,散热模块,光电子产业,OPTICAL PRECISION EQUIPMENT,THERMOELECTRIC COOLING DEVICES,AUTOMOTIVE,EMI电子元件,RFID标签,电源电阻器,MONITORING SYSTEM,RFID ANTI-METAL READER,TEMPERATURE REGULATOR,CHIP MODULES,散热片,芯片模组,元件,半导体案例,卫星,CASE,VR 设备,DC GROUNDING,无线通信设备,CHASSIS,射频接地电磁干扰,RF GROUNDING,RFID抗金属读写器,WIRELESS CHARGE PRODUCTS,监控系统,散热器,RF,POWER RESISTOR,新能源产业,手持移动电子设备,射频互联射频干扰屏蔽垫片,新能源行业,可穿戴设备,军事领域,BASE STATION ANTENNA DEVICE,RFID TAG,BETWEEN THE CHIP AND THE MODULE,SEMICONDUCTOR CASES,ELECTRO MAGNETIC SCREEN,电子消费品,手机,NEAR FIELD PAYMENT,高性能CPU,SATELLITE,在芯片和模块之间,显示卡处理器,LED LIGHT SOURCE,LED灯具,ELECTRONIC DEVICES,工业路由器,芯片与散热模块之间,电子产品,COMPUTERS,ELECTRONIC AND ELECTRICAL PRODUCTS,EMC ELECTRONIC COMPONENTS,RFID抗金属电子标签,NETCOM INDUSTRY,CHIP,高频模块,OPTOELECTRONICS INDUSTRY,HANDHOLD MOBILE ELECTRONIC DEVICE,消费领域,电磁屏,近场支付,平板,AUTOMOTIVE ELECTRONICS,芯片,显卡处理器,VR EQUIPMENT,软性电路板,RADAR,电脑,COMPONENT,5G BS,PADS,5G基站,手持移动电子装置,装配表面,汽车电子,OPTICAL INSTRUMENTS,DC,柔性线路板,电子电器产品,MAGNETIC SCREEN,汽车,FABRICATIONS,MICROELECTRONIC DEVICES,HIGH-PROPERTY CPU,GPU,EMI COMPONENT,WIRELESS CHARGING,无线通讯设备,无线充电产品,直流接地消除静电,外壳,RF INTERFERENCE SHIELDING GASKET,无线充电,CAMERA,MILITARY FIELDS,光模块产品,5G BASE STATION,元件对印刷电路板接地,磁屏,INDUSTRIAL ROUTER,5G手机,网通产品,HEAT DISSIPATION MODULE,电子设备,RFID ANTI-METAL ELECTRONIC TAG,LUMINOUS BODIES,汽车电池包,WIRELESS COMMUNICATION EQUIPMENT,家电行业,NETCOM PRODUCTS,雷达,FPC,底座,射频干扰屏蔽垫片,光学精密设备,NETCOM PRODUCTS •家电行业HOUSEHOLD APPLIANCE INDUSTRY,HIGH FREQUENCY MODULE,LED灯,LED LAMPS和发光体,微电子器件,LED LAMPS,直流,热电冷却装置,外壳对印刷电路板接地,AR设备,HOUSEHOLD APPLIANCE INDUSTRY,LED光源,基站天线装置,高性能中央处理器,BETWEEN CHIP AND HEAT DISSIPATION MODULE,温度调节器,AUTOMOBILE BATTERY PACK,消费者,CONSUMER,WEARABLE EQUIPMENT,EMC电子元件,OPTICAL MODULE PRODUCTS,射频接地,光电行业,NEW ENERGY INDUSTRY,半导体块,AR EQUIPMENT,通信设备,CONSUMER SECTORS,光学仪器,芯片模块,汽车电池组,网通行业,ELECTRONIC PRODUCTS,VR设备,发光体

专注于热管理及EMC材料领域

鸿富诚  -  导热界面材料,SMT泡棉,半包型导电泡棉,各项异性导热垫片,导电泡棉,EMI屏蔽材料,导热凝胶,导热吸波材料,吸波材料,导热垫片,导电毛丝,EMC吸波材料,HFC-AB系列,HFC-A系列,HFC-A,HFC-AB,EMI,散热系统,智能汽车新型能源,光模块,智能终端,电磁屏,3D相变散热器,AI,RFID,NFC,数据中心,游戏手机,电脑,电磁干扰,散热器,人工智能,一体式均温散热器,EMC,无线充电,热管散热器,一体式3D相变散热器,电磁兼容,分离式3D相变散热器

SMT导电泡棉系列 【屏蔽材料规格书】

鸿富诚  -  屏蔽材料,泡棉,SMFB,HFC-SMTSMFB-XXXX-XXXX-XXXXX,SMFA-0400-0400-00300,SMFB 系列,SMT 系列,SMFA-0400-0450-00500,HFC-SMT,SMT,SMFA-0300-0250-00200

GB半包导电泡棉系列【屏蔽材料规格书】

本资料介绍了GB半包导电泡棉系列产品的技术规格和应用领域。该系列产品适用于航天航空、电信和高速计算机等领域，具有良好的电磁屏蔽效能和耐温性。

鸿富诚  -  屏蔽材料,半包导电泡棉,导电泡棉,GBXXXXXX,HFC-GB,HFC-GB 系列,GB,电信,航天航空,无线通讯设备,手持移动电子设备,芯片模组,高速计算机

HFC-GR导电泡棉系列【屏蔽材料规格书】

本资料介绍了HFC-GR导电泡棉系列，这是一种结合了导电基材和硅胶泡棉的创新材料，具备良好的导电性、回弹性和电磁屏蔽效能。该产品适用于多种电子产品，包括手持移动设备、无线通讯设备和芯片模组等。

鸿富诚  -  屏蔽材料,全包导电泡棉,导电泡棉,HFC-GR 系列,HFC-GR,GRXXXXXX,军工,通讯,汽车,消费电子,元器件,电子设备,移动通讯设备,机壳,无线通讯设备,医疗,手持移动电子设备,电子机箱,芯片模组,笔记本电脑,工业设备,室内机箱